UNIVERSAL Stencil for Reballing with 55 different compatible types

BGA Reballing Stencil Template - This repair kit is specially designed for Samsung smartphones. Excellent replacement of IC or BGA rework and reassembly. Finely machined steel sheet that can be heated by a heat gun. The reballing stencil template can be easily and quickly implanted into the BGA / IC. Made of high-quality steel, which is strong and durable, ensures a long service life.